Camera IC Breakout Board
A "deadbug" style breakout board for a 20 pin BGA camera IC
This project was centred around the OVM7690 camera IC by OmniVision. It provides VGA resolution at 30fps all in a tiny chip scale package that is under 3mm X 3mm in size. The chip is very versatile and has many features which are configurable with the SCCB (essentially I2C) interface.
The problem was that the device is only available in a chipscale package which is a 20-pin BGA with 500µm pin pitch, which is less than ideal for prototyping. The purpose of this project was to make a breakout board for this device making prototyping possible. To do this, I used a technique called "deadbug" soldering which is used to convert SMD components (generallly much more reasonable size than this) into a more useable pinout.
Very precise soldering skills
Optical microscope skills (for inspection of connections)
Test equipment skills
A lot of patience